Pumice Powder
Brush or jet scrubbing of PCB’s with a pumice slurry is an effective method of surface preparation. After stripping the first photoresist, a second photoresist layer is laminated over the board and developed to expose selected portions of the solder. The exposed portions are selectively stripped. The copper exposed by the selective stripping is then subjected to a scrubbing while the photoresist protects the remaining solder, and the second photoresist is removed.

Fine powders 150 micron and below are recommended.

 

Aluminium Oxide
A high purity, single size blast media, supplied in a White Fused Alumina form. An alternative to pumice powder but not widely used due to the additional cost.

Range of macro and micro grits available.

For further information and case studies please contact us at: info@techfil.co.uk